IEEE Transactions on SIPI

The IEEE Transactions on Signal and Power Integrity publishes research and application papers addressing all aspects of signal integrity and power integrity of an electronic system and its components including integrated circuits, IC packages, printed circuit boards, cables, connectors, as well as other relevant electronic and microelectronic components, and signal integrity/power integrity co-design.  Advances in theory, algorithms, design approaches and modeling for ensuring the fidelity and performance of digital, analog, and hybrid electronic systems and sub-systems are considered. 

The Transactions on Signal and Power Integrity is a new journal, published only electronically, with the first papers appearing in January 2022.  The average days from submission to first decision is 52 days and decreasing, with a goal of 30 days.

Submit Papers through the IEEE Author Portal
Create an account on IEEE Author Portal using your IEEE credentials.
Conduct Reviews through Manuscript Central
Electronic access is available to digital subscribers through IEEE Xplore


The Editor-in-Chief is:
Professor Jun Fan, EMC Laboratory, Missouri University of Science and Technology, Rolla, MO
jun.fan@ieee.org

The Editorial Board is:

  • Zhiping Yang, PCB Automation, Inc., USA
  • Chulsoon Hwang, Missouri S&T EMC Laboratory, USA
  • Enxiao Liu,  A*STAR Institute for High Performance Computing, Singapore
  • Joungho Kim, Korea Advanced Institute of Science and Technology, South Korea,
  • Ram Achar, Carleton University, Canada
  • Dan Jiao, Purdue University, USA
  • Jai Narayan Tripathi, Indian Institute of Technology Jodhpur, India
  • Dries Vande Ginste, Ghent University, Belgium
  • Gabriela Ciuprina, Politehnica University of Bucharest, Romania
  • Renato Rimolo Donadio, Instituto Tecnológico de Costa Rica, Costa Rica
  • Erping Li, Zhejiang University, China
  • Istvan Novak, Samtec, , USA

The Steering Committee is:

  • James Drewniak – EMC-S (Chair), Missouri S&T EMC Laboratory, USA
  • Xiaoning Ye – EMC-S (Secretary), Intel, USA
  • Olena Zhu – EMC-S (Treasurer), Intel, USA
  • Daniel Luca – CEDA, Massachusetts Institute of Technology, USA
  • Stefano Grivet-Talocia – EPS, Politecnico di Torino, Italy
  • Ruey-Beei Wu – MTT-S, National Taiwan University, Taiwan
  • Flavia Grassi – EMC-S, Politecnico di Milano, Italy