You are cordially invited to submit your latest research results to the 2024 IEEE International Workshop on Advanced Interconnects (WAI 2024) that will be held on Nov 6 – 8, 2024, Ningbo, China.

This is the first International Workshop on Advanced Interconnects that is sponsored by the IEEE EMC Society. The scope of this workshop includes, but is not limited to signal and power integrity (SI/PI) of interconnects and electronic systems, electromagnetic compatibility (EMC) and electromagnetic interference (EMI) problems, radio-frequency interference (RFI) and antenna problems, electrostatic discharge (ESD) problems, etc.

Please note that WAI 2024 only accepts one-page abstract, and your one-page abstract will NOT be included in the SCI or EI index database in WAI 2024 due to the tight schedule of our first WAI conference. We apologize for any inconvenience caused. However, authors of high-quality abstracts will be invited to submit their extended papers to IEEE Transactions on Signal and Power Integrity! Also, Best Abstract Awards will be given to outstanding abstracts!

Moreover, you are encouraged to submit workshop or special session proposals. WAI 2024 provides a top international communication platform for advanced interconnects and electromagnetic compatibility techniques.

General Chair of WAI 2024: Dr. Jun Fan
General Co-Chair of WAI 2024: Dr. ER-PING LI

TPC Chair: Dr. Xiaoning Ye
TPC Co-Chair: Dr. Bo Pu
TPC Co-Chair: Dr. LING ZHANG

Submission Deadline – 30 September 2024