FPO
IEEE

The IEEE EMC Society
Distinguished Lecturer Program
Current Lecturers

Distinguished Lecturers

Dr. Andy Marvin - Kris Hatashita - Dr. Zhiping Yang - Dr. En-Xiao Liu - Dr. Kate Remley - Dr. Farhad Rachidi - Dr. Chunfei Ye

 

 

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Andy Marvin
email: andy.marvin@york.ac.uk
(Term 2017-2018)

Talk 1: Shielding
This lecture outlines the physical mechanisms that lead to electromagnetic shielding in materials and then describes how the materials can be used to fabricate a shielded enclosure. The limitations of shielding performance of the enclosures due to the enclosure structure are described.

Talk 2: Shielding Enclosure Metrics
The definitions of Shielding Effectiveness of enclosures and materials are reviewed. Then recent research on the use of surrogate contents to replicate real electronic enclosure contents is described leading to alternative definitions of enclosure shielding performance.


Talk 3: Thermal Noise Phenomena in Reverberation Chambers
The thermal noise performance of an antenna in the environment or an anechoic chamber is well known. What is the Noise Temperature of an antenna in a reverberation chamber? This lecture describes the thermal noise phenomena exhibited by antennas in reverberation chambers. Potential applications of the phenomena are described

 

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Dr. Zhiping Yang
email: zhipingyang@google.com
(Term 2017-2018)

Talk 1: Fundamentals of Signal Integrity
This talk will cover the basic topics related to signal integrity.  The example topics include inductance, transmission line, crosstalk, clock jitter, etc


Talk 2: Fundamentals of Power Integrity
This talk will cover the basic topics related to Power integrity.  The example topics include capacitor, power decoupling, power impedance measurement, power integrity simulation, etc. 


Talk 3: Advanced topics on signal integrity and power integrity
This talk will cover the advanced topics related to Power Integrity and Signal Integrity.  The example topics include ground concept, S-parameter, IBIS model, PCB material, etc. 


Talk 4: The myth about ground
GROUND is widely used in high-speed circuit modeling and simulation. However, there are a lot of misconceptions and misunderstandings about ground in the high-speed circuit industry. Does ideal ground really exist? If not, why do we use it in simulations? Should we connect the reference node of S-parameter model to ideal ground? Is ground bounce real and well defined? Should we put partial inductance and resistance on the ground net?   What can we do or cannot do with S-parameter model?  These questions are commonly asked by high-speed circuit designers. Answers from different people may be quite different and even contradictory.  In this presentation, these questions will be answered with some simple, but powerful examples.  At the end, the audience should have a better understanding about the ground and how to use it in high-speed simulations.

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Kris Hatashita
email: kris.hata@gmail.com
(Term 2017-2018)

Talk 1: Electromagnetic Environmental Effects in the Military
Military electromagnetic compatibility (EMC) is a matter of life and death as modern war-fighters rely on the safe, secure and reliable functioning of their devices. Military EMC includes aspects of electronic interoperability that are seldom or never considered in the commercial realm. This talk presents technical details of EMC consideration in tactical and strategic military operations. The topics discussed include hazards of electromagnetic radiation to ordnance (HERO), electromagnetic data security (EMSEC), counter improvised explosive device (CIED) EMC issues and includes first-hand experiences of work done in the Afghan theatre.


Talk 2: Electronic Warfare and the Weaponization of the Electromagnetic Spectrum
Before 1911 wars were fought either on land or on water.  The experience of millennia of battles in these two theatres shaped the doctrines of warfare and guided the development of strategies and tactics right up until the introduction of four new theatres in the 20th century.  These new theatres - air, space, cyberspace, and the electromagnetic spectrum - all introduce new concepts that may or may not fit into existing doctrines.   This talk centers on the idea of the electromagnetic spectrum (EMS) as a new theatre of war and how existing military doctrines fit into this concept.  We will explore how the EMS is used, exploited, compromised and fought over in battles that take place on land, water, air, space and cyberspace.

 

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Dr. En-Xiao Liu

email: liuex@ihpc.a-star.edu.sg
(Term 2017-2018)

Talk 1: Modeling and simulation for EMC and Signal/Power Integrity of High Speed Electronics
Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensable role in modern high speed electronic design.  This talk will first give an overview of the different categories of methodologies used for SI/PI/EMC modeling and simulation of high speed electronics. Then it is focused on the modal decomposition based 2.5D methodologies and their applications. Recent development of the 2.5D methodology for analysis of SI/PI and EMC in multilayer PCBs will finally be presented.


Talk 2: EMC of Nano-composite Laminate Material for Aeronautic Application
This talk will first introduce the latest development of nano-composite laminate material with a focus on improving its electrical conductivity for aeronautic applications. The EMC performance analysis of the composite material will be elaborated on two aspects: lightning strike protection and shielding effectiveness. Both experimental testing and modeling results will be discussed.

Talk 3: 3D IC and EMC
The rapid growth and convergence of digital computing and wireless communications have been driving the semiconductor technology to continue its evolution following Moore’s law in today’s nanometer regime and More-than-Moore in the system integration arena. Modern electronic systems, with densely packed complex components and devices, result in a very complex electromagnetic environment. Electromagnetic compatibility (EMC) has thus become one of the major issues, especially for the lately proposed 3D integrated circuit (IC) design. This talk will cover the modeling, measurement, design, and analysis of TSV based 3D ICs, with an emphasis on the EMC related issues and solutions.

Talk 4: Near Field Scanning and its EMC Applications: Theories, Practices, and Applications
The more than sixty-year history of near field scanning sees the development and application of near field measurements first for antennas, then lately for electromagnetic compatibility (EMC) of high speed electronics. This talk is first devoted to a brief overview and summary of the near field scanning for antenna measurement, which covers relevant key theories, practices, and applications. Those well established theories and practices lay solid foundations for the near field scanning in EMC applications, though near field scanning for EMC has its own distinctive features and requirements. The talk then focuses on the discussion of the development, status, and some open issues regarding the near field scanning for EMC applications.

 

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Dr. Kate Remley
email: kate.remley@nist.gov
(Term 2016-2017)

An Introduction to Free-Field Measurements of Wireless Devices in Reverberation Chambers (general overview of what types of wireless tests can be done in RCs)
When the antenna is integrated into the body of a wireless device, as it is for cell phones and many other portable devices, performance testing is typically done under free-field conditions. In this overview presentation, we will discuss free-field characterization of some key wireless-device parameters by use of reverberation chambers. Measurements in reverberation chambers must be averaged over a sufficient number of samples in which the modes of the chamber are randomized or “stirred.” We will discuss recent research on the use of these chambers for testing devices that transmit modulated signals.

Over-the-Air Testing of Large Cellular Wireless Devices in Reverberation Chambers (more advanced discussion of specific methods for loading and verifying chamber performance)
While the smartphone comes to mind when cellular technology is mentioned, the number of machine-to-machine device applications is also on the rise. These devices may take on large form factors such as parking kiosks, vending machines, car dashboards and the fast growing area of wearable devices that must be tested on body phantoms. Reverberation chambers can provide a relatively low-cost, repeatable laboratory environment for testing these larger cellular wireless devices. However, for some key metrics, the chamber set-up must provide channel conditions similar to those in which the receiver was designed to operate. This may require additional loading of the chamber, complicating both test procedures and uncertainty analyses. We discuss methods for configuring reverberation chambers and assessing uncertainty in the measurement of large-form-factor cellular devices.

Bringing Precision to Measurements for Millimeter-wave 5G Wireless (conducted and free-field modulated-signal measurements)
At millimeter-wave frequencies and for wide modulation bandwidths, the hardware performance of both modulated-signal sources and vector receivers becomes increasingly nonideal. These nonidealities make test and validation of devices, circuits and systems not only more important, but also more difficult. This is especially true because future systems will likely push the limits of modulation complexity and bandwidth to increase data throughput. We will discuss calibration and measurement techniques to correct millimeter-wave modulated-signal measurements illustrating that traditional assumptions at microwave frequencies may not be adequate at millimeter-wave frequencies.

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Dr. Farhad Rachidi
email: Farhad.Rachidi@epfl.ch
(Term 2016-2017)

Everything you don't know about lightning...and nobody else does either
Since 1752 when Franklin conducted his famous kite experiment, significant progress has been achieved in understanding lightning discharge and its effects. However, still may questions remain unanswered in various fields of lightning including lightning physics and lightning protection. In this lecture, an overview of lightning phenomenology and recent progress on lightning research is presented.

Measurement of lightning currents at Mount Säntis in Switzerland
This talk reports on the instrumentation of the Säntis telecommunications tower in Switzerland for the measurement of lightning current parameters, as well as an overview of the obtained data. The Säntis tower was instrumented in May 2010 and during its first 5 years of operation, more than 500 flashes were successfully recorded. The Säntis station is the highest lightning current measurement station (2500 m ASL) with the highest incidence (100 flashes / year)

A Review of Field-to-Transmission Line Coupling Models with Particular Reference to Lightning-Induced Voltages
In this lecture, the general theory describing the interaction of an impinging electromagnetic field with transmission lines is presented, with particular reference to lightning-induced voltages.

Electromagnetic Time Reversal and its application to EMC
Electromagnetic Time Reversal has recently found interesting applications in EMC. In this talk, the concept of time-reversal invariance will be described with special attention to Maxwell’s equations. Then, examples of application of Electromagnetic Time Reversal in EMC will be presented and discussed.

 

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Dr. Chunfei Ye
email: chunfei.ye@intel.com
(Term 2016-2017)

High-speed signal integrity fundamental
Key concepts, import factors, enablers, methodology, etc., related to SI will be covered.   

Impedance discontinuity and design optimization for high-speed differential Ios
Will present some learnings on channel impedance optimization including buffer and interconnect to achieve optimal SI performance by considering spec compliance and cost

Crosstalk control, mitigation and management in high speed interconnect
Addresses one of the key challenges in SI, i.e. crosstalk, by shielding, separation, inductive/capacitive coupling adjustment, crosstalk cancellation, pin-out arrangement, PCB via management, etc. for design optimization.

 

 

 

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