Talk 1: Shielding
This lecture outlines the physical mechanisms that lead to electromagnetic shielding in materials and then describes how the materials can be used to fabricate a shielded enclosure. The limitations of shielding performance of the enclosures due to the enclosure structure are described.
Talk 2: Shielding Enclosure Metrics
The definitions of Shielding Effectiveness of enclosures and materials are reviewed. Then recent research on the use of surrogate contents to replicate real electronic enclosure contents is described leading to alternative definitions of enclosure shielding performance.
Talk 3: Thermal Noise Phenomena in Reverberation Chambers
The thermal noise performance of an antenna in the environment or an anechoic chamber is well known. What is the Noise Temperature of an antenna in a reverberation chamber? This lecture describes the thermal noise phenomena exhibited by antennas in reverberation chambers. Potential applications of the phenomena are described.
Talk 1: Fundamentals of Signal Integrity
This talk will cover the basic topics related to signal integrity. The example topics include inductance, transmission line, crosstalk, clock jitter, etc
Talk 2: Fundamentals of Power Integrity
This talk will cover the basic topics related to Power integrity. The example topics include capacitor, power decoupling, power impedance measurement, power integrity simulation, etc.
Talk 3: Advanced topics on signal integrity and power integrity
This talk will cover the advanced topics related to Power Integrity and Signal Integrity. The example topics include ground concept, S-parameter, IBIS model, PCB material, etc.
Talk 4: The myth about ground
GROUND is widely used in high-speed circuit modeling and simulation. However, there are a lot of misconceptions and misunderstandings about ground in the high-speed circuit industry. Does ideal ground really exist? If not, why do we use it in simulations? Should we connect the reference node of S-parameter model to ideal ground? Is ground bounce real and well defined? Should we put partial inductance and resistance on the ground net? What can we do or cannot do with S-parameter model? These questions are commonly asked by high-speed circuit designers. Answers from different people may be quite different and even contradictory. In this presentation, these questions will be answered with some simple, but powerful examples. At the end, the audience should have a better understanding about the ground and how to use it in high-speed simulations.
Talk 1: Electromagnetic Environmental Effects in the Military
Military electromagnetic compatibility (EMC) is a matter of life and death as modern war-fighters rely on the safe, secure and reliable functioning of their devices. Military EMC includes aspects of electronic interoperability that are seldom or never considered in the commercial realm. This talk presents technical details of EMC consideration in tactical and strategic military operations. The topics discussed include hazards of electromagnetic radiation to ordnance (HERO), electromagnetic data security (EMSEC), counter improvised explosive device (CIED) EMC issues and includes first-hand experiences of work done in the Afghan theatre.
Talk 2: Electronic Warfare and the Weaponization of the Electromagnetic Spectrum
Before 1911 wars were fought either on land or on water. The experience of millennia of battles in these two theatres shaped the doctrines of warfare and guided the development of strategies and tactics right up until the introduction of four new theatres in the 20th century. These new theatres - air, space, cyberspace, and the electromagnetic spectrum - all introduce new concepts that may or may not fit into existing doctrines. This talk centers on the idea of the electromagnetic spectrum (EMS) as a new theatre of war and how existing military doctrines fit into this concept. We will explore how the EMS is used, exploited, compromised and fought over in battles that take place on land, water, air, space and cyberspace.
Dr. En-Xiao Liuemail: firstname.lastname@example.org
Talk 1: Modeling and simulation for EMC and Signal/Power Integrity of High Speed Electronics
Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and the highly integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensable role in modern high speed electronic design. This talk will first give an overview of the different categories of methodologies used for SI/PI/EMC modeling and simulation of high speed electronics. Then it is focused on the modal decomposition based 2.5D methodologies and their applications. Recent development of the 2.5D methodology for analysis of SI/PI and EMC in multilayer PCBs will finally be presented.
Talk 2: EMC of Nano-composite Laminate Material for Aeronautic Application
This talk will first introduce the latest development of nano-composite laminate material with a focus on improving its electrical conductivity for aeronautic applications. The EMC performance analysis of the composite material will be elaborated on two aspects: lightning strike protection and shielding effectiveness. Both experimental testing and modeling results will be discussed.
Talk 3: 3D IC and EMC
The rapid growth and convergence of digital computing and wireless communications have been driving the semiconductor technology to continue its evolution following Moore’s law in today’s nanometer regime and More-than-Moore in the system integration arena. Modern electronic systems, with densely packed complex components and devices, result in a very complex electromagnetic environment. Electromagnetic compatibility (EMC) has thus become one of the major issues, especially for the lately proposed 3D integrated circuit (IC) design. This talk will cover the modeling, measurement, design, and analysis of TSV based 3D ICs, with an emphasis on the EMC related issues and solutions.
Talk 4: Near Field Scanning and its EMC Applications: Theories, Practices, and Applications
The more than sixty-year history of near field scanning sees the development and application of near field measurements first for antennas, then lately for electromagnetic compatibility (EMC) of high speed electronics. This talk is first devoted to a brief overview and summary of the near field scanning for antenna measurement, which covers relevant key theories, practices, and applications. Those well established theories and practices lay solid foundations for the near field scanning in EMC applications, though near field scanning for EMC has its own distinctive features and requirements. The talk then focuses on the discussion of the development, status, and some open issues regarding the near field scanning for EMC applications.
Talk 1: Challenges and Methods to Improve Accuracies in Antenna Calibrations and Site Qualification Measurements below 1 GHz
It is impractical to achieve a far-field and free-space environment for EMC antenna calibrations below 1 GHz due to the long wavelengths. Anechoic absorbers are also typically not large enough to achieve the requisite reflectivity performance to calibrate antennas. Standard site method (SSM) in an open area test site over a PEC ground plane is the industry standard for calibrating these low gain/low frequency antennas. Realizing most measurements are not performed in the far field in this frequency range, an accurate free-space antenna factor (AF) is actually not the most accurate representation of the underlying physics. Free-space AF (or gain) is shown as a compromised average, which yields low “enough” uncertainties. However, for anechoic chamber evaluations where much lower uncertainties are desired, a more rigorous model, including near-field effects, pattern variations, and phase center movement is needed. We discuss the assumptions and limitations of the SSM and the state-of-the-art research on improving the accuracy for antenna calibrations for both free-space antenna factors and site validation measurements.
Talk 2: Optimizing Results from Electric Field Probes during EMC Testing
In this presentation, we discuss the theory and applications of electric field probes as well as calibration methods. The presentation will discuss the influencing factors of the measurement uncertainties from the calibration process as well as during the end use, and practical considerations on how to reduce the effects.
Talk 3: Time Domain Site VSWR for Anechoic Chamber Evaluation
Typical anechoic chambers are evaluated using the site VSWR (for EMC chambers) or Free-space VSWR (antenna measurement chambers). In these methods, a receive antenna (probe antenna) is scanned over a distance. The standing wave in the chamber is measured, and the chamber reflectivity is derived from this measurement. This measurement can be performed alternatively by transforming the vector response in time domain (through inverse Fourier transform). In time domain, the reflections can be separated from the antenna main responses due to their time delays. The time domain VSWR method is currently being incorporated into the new ANSI C63.25 standard. We will discuss the implementations, benefits and challenges of using this method
Talk 1: Physical Insights and Analytical Methods for Signal Integrity in High-Speed Designs
While the signal integrity challenges due to increasing switching frequencies and sharper edge rates of data are becoming major bottlenecks in high-speed designs, the analysis tools are continuously playing the catch-up. Although 3D-EM simulators are available today for analysis of critical paths and design modules, they are very slow for practical purposes and can blur the designer’s insight into the fundamentals of the problems they are trying to solve. This emphasizes the importance of analytical electromagnetic techniques in signal integrity. For serial data links, which can transmit data rates over 56 Gbps, the analysis of interconnect, discontinuities like crossing junctions, slots on reference planes and vias cannot be overstated. Conformal mapping methods combined with microwave analysis techniques will be discussed as a quick and accurate supplementary simulation tool to computationally intensive and opaque numerical methods. Physical insight into the underlying problems will be provided, enabling faster signal integrity analysis of disjoint modules as well as full systems.
Talk 2: Fundamentals and Advances in Power Integrity Modeling and Analysis Methods
For multicore processors with current loads exceeding 100 A, the power noise is not only a growing electromagnetic interference (EMI) concern, but also a potential logic problem in high-speed printed circuit designs. Depending on the type of application, on-board or on-package local decoupling capacitors are the most commonly used components to mitigate this problem. The board/package real-estate concerns, however, impede the haphazard placement of these components and makes imperative the use of optimization methods for their most effective placement and selection. The computation of power noise in high-speed designs lies at the core of all optimization techniques. For decades, the computation methods that rely on lumped circuit theory have been very popular as quick and dirty analysis tools. At today's circuit speeds, however, they are too simplistic for accurate results. Numerical electromagnetic analysis tools are arguably the reliable alternatives but they are computationally too intensive for repetitive analysis. Semi-analytic algorithms based on planar circuit theory will be discussed as a balance between these two extreme cases. Accuracy and performance comparison with state-of-the art tools will be provided. The practical implications of these methods will be discussed with application to real-life scenarios.
Talk 1: EMC Fundamentals, Diagnosis and Challenges
Electronics have been widely applied in our work and life because of rapid technology advancement. In electronics, some are designed to generate and transmit signals, others are sensitive receivers. The signal quality, or data quality, is one of the inevitably basic but critical requirements in communications. According to the nature of electricity, the signal quality could be affected by all parameters/factors involved in data communications. The quality is mostly referred to as the tolerance level to the internal and external electromagnetic environment. This situation is directed to electromagnetic compatibility (EMC) which is thus a crucial element in any modern electronics design. EMC is the ability of electronic/electric devices and systems that operate in their intended operational environment without suffering unacceptable degradation or causing unintentional degradation because of electromagnetic radiation, coupling or interference. It involves the electromagnetic spectrum control and management; concepts and doctrines for maximizing operational effectiveness, and system design configuration and guidelines for interference-free operation. This talk will be given in two parts: the first part presents the fundamental phenomena of electromagnetic interference, and second part addresses EMI diagnosis and EMC challenges.
Talk 2: Common-mode Electromagnetic Noise Mitigation for High-Speed Electronics
A wideband and compact microstrip filter for mitigating common-mode electromagnetic (EM) noise in high-speed electronic circuits is presented in this talk. By using specific slots etched in a ground metallic plane, which forms a defected ground structure (DGS), the common-mode noise can be suppressed. The effect of the DGS on the electromagnetic characteristics of the microstrip lines is examined. It is proved that the common-mode noise can be reduced at least by 15 dB at operational frequency with a broad bandwidth, whilst the differential signal is unaffected. An equivalent circuit model is also built based on the simulation result to understand the filtering behavior. The filter size is comparably small to the operational wavelength. A substrate-filled metallic cavity beneath a conventional DGS is proposed for the application in multilayer printed circuit boards. Behaving as electromagnetic shielding and absorption for the cavity, the back-radiation from the DGS is effectively reduced, while the filtering characteristic of the DGS is retained in the interested frequency band. The optimization technique is employed to realize the optimal filter with robust properties. The DGS based filtering technique can effectively tackle the EMI issue by increasing microstrip line insertion loss. It can be used extensively in microwave filter design.
Talk 3: Effective Modeling and Characterization of Lightning Effect on Aircraft Composite
The lightning strike on aircraft can induce a very large amount of electric current that redistributes on the aircraft skin. This could lead to a possible hazard. The extent of damage caused by a lightning strike increases due to the increased use of composite material in aerospace development. For instance, carbon fiber reinforced polymer (CFRP) is employed for aircraft fuselage and wing design. Since the lightning phenomenon and its direct redistribution effects are very complex, it is imperative to study the intrinsic characteristics of lightning direct and indirect effects on composite material through theoretical modeling and computational simulation. This is because experimental labs have tremendous difficultly duplicating the real lightning phenomenon. A theoretical modeling study examines the internal electromagnetic performance of different plies of composite materials and understands the conditions that may result in delamination or dielectric breakdown at the interface in the composite laminates and between composite and metallic objects. The current-carrying capability of composite is characterized for enhancing the aircraft lightning protection.